Optimised for rapid R&D cycles
Compatible with multilayer PCBs
Supports advanced electronic assemblies
Complete PCB finishing processes
Tracks Laser & Electronics Ltd supports PCB prototyping beyond board manufacturing with additional finishing processes, including through-hole plating, solder mask coating, solder paste printing, assembly, and reflow soldering.
These stages help convert a manufactured circuit board into a fully functional electronic assembly suitable for advanced engineering and medical research applications. Our systems are designed for laboratory compatibility, allowing us to complete finishing operations efficiently while maintaining reliable electrical performance and controlled processing throughout prototype development workflows. For more details, reach out today.
Through-hole plating methods
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Chemical-free LPKF ProConduct® supports through-hole plating up to 0.4 mm diameters
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Aspect ratios of up to 1:4 can be processed efficiently
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Average electrical resistance remains extremely low at around 19 milliohms
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The process supports double-sided and multilayer PCB applications
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A paste-based coating allows compact, fast, and straightforward operation
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LPKF Contac S4 combines electrolytic and chemical plating processes in one safety housing
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System-guided operation removes the need for specialist chemistry knowledge
Through-Hole Plating of Printed Circuit Boards
LPKF ProConduct is a fast, easy-to-use through-hole plating solution designed for double-sided and multilayer PCBs. All holes are plated simultaneously in a single parallel process, delivering a safe, consistent, and temperature-resistant result. When paired with an LPKF circuit board plotter, complete prototypes can be produced entirely in-house within a single day — shortening development cycles, eliminating external service costs, and keeping sensitive design data within your own facility.
The technology behind ProConduct is highly refined. It metallises through-holes up to 0.4 mm in diameter with an aspect ratio of 1:4, achieving an electrical resistance of just 10–25 mΩ. Even after 250 temperature change cycles, resistance increases only marginally, confirming the long-term reliability of every plated connection.
The process itself follows three straightforward steps. The PCB is first milled using an LPKF circuit board plotter, after which a protective foil is applied and through-holes are drilled. The ProConduct paste is then applied via squeegee across the foil surface, with a vacuum table drawing the conductive paste through to coat the inner walls of each hole. The board is flipped and the process repeated on the reverse side, ensuring complete and uniform metallisation throughout.
Through-Hole Plating for the Lab
The LPKF Contac S4 brings reliable galvanic through-hole plating into the laboratory environment without requiring any knowledge of chemistry. Combining multiple galvanic and chemical processes within a compact, chemical-resistant safety housing, it is designed to handle the demands of advanced PCB prototyping cleanly and consistently.
At the core of the system is a six-bath cascade that routes each board through every stage in sequence, depositing homogeneous copper layers across the walls of all through-holes.
The Contac S4 supports boards of up to eight layers with a maximum aspect ratio of 1:10, and includes a final tin bath to protect the surface and improve solderability. Optimised anode plates, reverse pulse plating, and black hole activation technology work together to ensure uniform copper deposition — both within the holes and across the flat substrate surface — with no interfering interfaces.
Despite its technical sophistication, the system is straightforward to operate. An integrated touch control panel with a guided assistant and parameter management walks users through the entire electroplating process, making it accessible even without prior experience. Maintenance tasks are flagged automatically, and no bath analyses are needed during operation. Experienced developers retain the option to apply custom settings at any time, giving the Contac S4 the flexibility to serve both everyday prototyping and more demanding development work.
