We cut complex contours in minutes
We are specialists in FR4, FR5, CEM, ceramics
Mechanical and laser depaneling available
PCB cutting and depaneling methods
Tracks Laser & Electronics Ltd uses both mechanical milling and laser structuring methods for PCB cutting and depaneling, depending on the material and project requirements. Our systems allow cutting contours to be completed within minutes while supporting a wide range of circuit board substrates. One or multiple boards can be arranged on a base panel and separated accurately using LPKF ProtoMat or ProtoLaser systems, supported by software tools and parameter libraries for efficient setup. Get in touch with our team today.
Mechanical Depaneling
LPKF ProtoMat systems use specialist milling tools to depanel standard PCB materials, including FR4 and FR5 efficiently and at speed. Higher rotational speeds allow finer tooling to be used, which is particularly beneficial when working with base materials intended for RF applications where precision and clean edge definition are essential.
Laser Depaneling
LPKF ProtoLaser systems handle tab separation and complex contour cutting with clean, burr-free results. The laser is well suited to a broad range of substrates including FR4, FR5, CEM materials, ceramics, polyimides, and RF materials, making it a versatile option for boards where mechanical milling would risk damage or imprecision.
Cutting and Drilling of Board Materials
Beyond depaneling, both mechanical and laser-assisted machining can be performed on a wide range of board materials using LPKF systems. This includes the production of polyimide stencils and other precision-cut components, with ProtoMat handling mechanical fabrication and ProtoLaser covering more intricate or material-sensitive tasks. Further capabilities are covered under micro material processing in the lab.
