Complete prototyping cycle in one day
Individually calibrated benchtop machines
Multi-layer PCB capability up to 8 layers
Precision laser processing for advanced materials
Tracks Laser & Electronics Ltd uses laser-based micro-material processing to achieve extremely fine structural accuracy, including cut channels down to around 15 µm. This level of precision supports PCB structuring and drilling while allowing us to handle sharp edges and tight corner radii, which is particularly valuable for high-frequency applications.
Our approach supports both delicate and demanding material work, helping us maintain control over fine geometries while ensuring consistent outcomes across complex engineering and research-driven projects.
Laser system capabilities across material types
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Ultrashort pulse lasers for cold ablation with minimal thermal impact
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Thin film processing for OLED lighting and solar cell applications
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Controlled surface machining on FR4 materials using visible-spectrum lasers
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Ceramic substrate processing, including Al₂O₃ and LTCC applications
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Precise copper ablation on coated FR4 materials
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Integrated software for material-specific parameter adjustment
Controlled processes for research-driven fabrication
At Tracks Laser & Electronics Ltd, we rely on structured laser processes supported by extensive material libraries and validated parameters stored within the system software. This allows us to carry out consistent ablation, cutting, and drilling across a wide range of substrates with efficiency and repeatability. We also retain the flexibility to fine-tune settings where required, ensuring each application is aligned with specific research or development needs without compromising precision or reliability.
Advanced lab processing systems
Call us today for micro material processing support systems.
