Precision holes down to 0.15 mm
Supports RCC, FR4, FR5, Teflon®, Thermount®
Tailored guidance from our application specialists
Through-hole and blind via drilling
At Tracks Laser & Electronics Ltd, we use LPKF circuit board plotters and ProtoLaser systems to produce through-holes and blind vias across a wide range of PCB applications. Our drilling solutions support precise hole creation for different board structures and material requirements. By combining mechanical and laser technologies, we can handle both standard and advanced PCB prototyping tasks while maintaining controlled accuracy and efficient processing throughout the manufacturing workflow.
Laser drilling for fine microvia processing
Tracks Laser & Electronics Ltd uses LPKF ProtoLaser systems for efficient laser drilling of microvias with diameters below 200 μm. These systems support processing across multiple substrates, including RCC, FR4, FR5, Teflon®, and Thermount®.
The ProtoLaser U4 also enables accurate drilling and cutting on ceramic substrates, helping us support delicate and high-precision applications. Our application specialists can also assist with material sampling and suitable process recommendations where required, while our virtual 3D product showroom offers a closer look at the systems and technologies available.
Mechanical drilling for flexible PCB production
We use LPKF circuit board plotters as a practical and cost-effective solution for drilling FR4 boards in different shapes, densities, and resolutions. Mechanical drilling supports hole diameters starting from 0.15 mm, while laser systems are available for smaller requirements where additional precision is needed. The systems also handle larger cut-outs within FR4 substrates efficiently, allowing us to support varied PCB layouts, SMT/finishing requirements, and manufacturing applications across multiple prototyping and development projects.
